Magnetics

SCI magnetics give you the flexibility you need. Provided with encapsulated magnets, these sputtering magnetrons are adaptable to fit your process requirements.
 

SCI advanced sputtering magnetic system features include the following:

• Multiple designs to fit your application requirements
• Designed using 3D finite element analysis software
• Carefully matched, high-strength magnets that are factory calibrated using an automated magnet bar measurement tool
• Fully encapsulated magnets and robust construction for many years of trouble-free operation
• Long-life, multi-roller system for sputter up, sputter down or off-angle sputtering
• Magnetic uniformity adjustments that can be done easily in the field
• A simple installation procedure with solutions for vertical installations
 

FEATURES

TRM-Bar™

• Industry-proven design with thousands of bars currently in operation
• High rate reactive mode or metal mode sputtering of optical grade films

mQRM-Bar™

• Small magnet 4-row design increases strength by 50% over the TRM
• No plasma-forming fringe field
• Lower impedance than the TRM

QRM-Bar™

• Stronger "patent pending" magnetics for low impedance sputtering of TCOs and other electrical grade films
• Increased sputtering efficiencies reduce power consumption and operating costs
 

BENEFITS

TRM-Bar™

• Narrow deposition profile minimizes coating losses to waste shields
• Multiple turn-around designs for different application requirements. The turn-arounds can be easily changed

mQRM-Bar™

• Target materials 170mm or less that require high utilization
• Processes that require lower impedance and are more stable over the lifetime of the target material: reactive sputtering, ITO
• Applications for smaller sputter angles

QRM-Bar™

• Lower impedance plasma enables higher power densities and higher achievable sputter rates for most materials
• Increased process stability over the life-time of the target material